Advanced packaging that’s no bigger than the die itself brings together high performance and high reliability with small size and low cost. Not so long ago, defense and aerospace applications were the ...

The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...

Leading integrated circuit (IC) foundries are already shipping 7-nm and 5-nm wafers and 3-nm product qualifications are ongoing. Wafer costs continue to soar as high transistor density requires ever ...

The global semiconductor and IC packaging materials market generated revenue of USD 48.48 billion in 2025, and is projected to grow to USD 114.28 billion in 2034, according to research conducted by ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

Much has been written in the past few months about the upcoming sunset of Moore’s Law. Stated succinctly, Gordon Moore predicted in 1965 that the number of transistors in ICs would double every 12 ...

Taiwan Semiconductor Manufacturing Company Ltd (NYSE:TSM) leads in advanced chip packaging patents, followed by Samsung Electronics Co, Ltd (OTC:SSNLF) and Intel Corp (NASDAQ:INTC). Advanced chip ...

While Tesla aims to reduce the amount of silicon carbide (SiC) components by 75%, sources in the related industrial sectors nevertheless believe that SiC, with its good heat resistance capability, ...

TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs. Taiwan-based driver IC OSATs ...

Apple is gearing up to use TSMC's latest SoIC advanced packaging technologies for its next-generation M5 chips as part of a two-pronged strategy for the company to power its future Macs and AI servers ...